MIRTEC has implemented a next-generation vision system featuring
7.7µm/10µm/15µm high-resolution lenses for greater precision and stability in inspection.
Additionally, the CoaXPress interface enables high-speed inspection, while the 25M/15M high-resolution camera provides
a large field of view (FOV) for enhanced performance.

MIRTEC's patented Digital Blue Moiré Technology enables precise 3D inspection across a wide range (0mm to 25mm)
using a combination of high, medium, and low-frequency fringe patterns.
It ensures stable inspection quality, regardless of the color or brightness of the object within the FOV.

All MIRTEC 3D AOIs are equipped with an 8-Phase Coaxial Color Lighting System, including coaxial lighting, which consists of coaxial white,
primary vertical white, secondary vertical white, horizontal white, blue, red, green, and yellow.
This ensures optimal inspection conditions at all times, regardless of the PCB or the inspection object's color and material.

MIRTEC’s Auto-Matching function uses AI based Deep Learning in order to maximize the efficiency and accuracy of the AOI programming process.
When this function is used, work time can be reduced by 90% compared to traditional manual teaching and 50% compared to
automatic teaching without deep learning.
Best of all, every process is automated with Teaching Wizard, so even new operators are able to maintain the teaching quality of
about 85% of the highest skilled operators.

By incorporating Z-axis movement in the optics and adding a GPU to the system, the MV-6 OMNI can inspect tall parts up to 45mm, exceeding the measurement limits of 25mm in conventional 3D AOIs.

Four high-resolution side cameras enable side-view OCR inspection and solder inspection of J-leads, coils, and QFNs, which are challenging to inspect from a top-down perspective.

Equipped with an internal flipper for double-sided PCB inspection,
the system allows you to inspect both the top and bottom of a PCB without requiring external equipment.