With a clearance of 70mm on the top and 100mm on the bottom, the system easily accommodates the inspection of PCBs with tall components.

The MV-3CC supports an ultra-high-resolution optical system up to 65MP 4.3µm for precise bubble inspection. Additionally, the system is equipped with an AI-driven algorithm that continuously improves inspection performance as it learns, ensuring even greater accuracy over time.

MV-3CC utilizes UV lighting at three angles: low angle, high angle, and coaxial. Using UV light from a single angle can result in shadows from components or insufficient light intensity, potentially leading to missed defects. However, MV-3CC provides multi-angle UV illumination, ensuring clear imaging and highly accurate defect detection.

When uncoated areas appear on the side of a chip, leads, or solder, or when coating splatters in unintended areas, or bubbles and cracks form, the 18MP high-resolution side camera accurately detects these coating defects

Sensors capable of measuring the thickness of transparent materials, such as coatings and films, can be used to inspect coating thickness on the top surface of components and PCBs