PRODUCT

MS-11 Series

Outstanding performance at resonable price

Outstanding performance

- Super high resolution CXP camera and precision 6㎛ lens
- Solder paste inspection up to 0201(㎜) size component pad
- High accuracy & repeatability
- Shadow-free dual projection 3D measurement
- Various camera line-up from high-performance 25 mega pixel to economical 4 mega pixel

Auto PCB warpage compensation
Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine
Intellisys® : Total process management system for improving productivity and achieving smart factory
Standard 3D AOI for various manuracturing process
INQUIRY
CLOSE