MS-11 Series

Premium 3D SPI System

Outstanding performance

- Super high resolution CXP camera and precision 6㎛ lens
- Solder paste inspection up to 0201(㎜) size component pad
- High accuracy & repeatability
- Shadow-free dual projection 3D measurement
- Various camera line-up from high-performance 25 mega pixel to economical 4 mega pixel

Auto PCB warpage compensation

Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine

Intellisys® : Total process management system for improving productivity and achieving smart factory

Standard 3D AOI for various manuracturing process

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