MS-15 Series
Precision 3D SP for second process of semiconductor manufacturing
The world's best performance 3D SPI
- Super high resolution CXP camera and precision 6㎛ lens
- Solder paste inspection up to 0201(㎜) size component pad
- 30㎛ height solder paste inspection
- Shadow-free dual projection 3D measurement
- High accuracy and repeatability with linear motor drive system