GENESYS-AUTOAutomotive Specialized 3D AOI

Inspection with a maximum height of 50㎜

- MIRTEC's unique Hybrid 3D Technology
- Inspection using Z-axis movement of the optical system
- High precision with a maximum height measurement criterion of ±15㎛ (50,000㎛)

Press-fit pin, single pin, pin array, fork pin, connector pin inspection

Inspection possible for THT, SMD components, and pin components

Side-Viewer® : simultaneous inspection on five sides using an 18-megapixel side cameras

Intellisys® : Integrated process management system realizing increased productivity and smart factory