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T h e MX- 9CL a r e d e s i g n e d t o automatically inspect for manufacturing defects after the reflow process. These systems detect defects of minute parts such as BGA and CSP on SMT process. |
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System Specifications | |
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Type |
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Inspection PCB Area |
50 x 50 mm ~ 400 x 500 mm
(2.0 x 2.0 ~ 15.7 x 19.7 inch) |
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Robot Move Distance |
Stroke : 400 x 500 x 250 mm
(15.7 x 19.7 x 8.8 inch) |
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| Rot : ±180° | |
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Field Of View/Resolutiop |
| Max : 47.0 x 35.25 mm (1.85 x 1.39 inch) / 34.56 μm/pixel |
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| Min : 2.0 x 1.5mm (0.08 x 0.06 inch) / 1.47 μm /pixel | |
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Geometrical Capacity |
Up to 45x |
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Display Resolution |
Up to 1590x |
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Camera Resolution |
1.4M (1,360 x 1,024 Pixels) |
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Dimensions |
1115(W) x 1455(D) x 1720(H)mm
(43.9 x 57.3 x 67.6 inch) |
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Weight |
1200 Kg (2,649 lbs) |
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X-ray |
| Voltage : 0 ~ 90 KV, Current : 0~ 200 μA |
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| Focal Spot Size : 5 μm, Closed type | |
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Image Photomultiplier Tube |
Resolution : 9 lp/mm (Dual Field) |
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PC |
IntelR CoreTM 2 Duo, 19" LCD Monitor, Windows XP Professional |
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Power Requirements |
Single phase AC 220V ±10%, 50/60Hz |
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Environment |
Temperature: 10 ~ 40°C, Hunidity: 30~80% RH |
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Leakage Dose |
X-ray leakage??1μSv/h | |
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Operation |
X-Y movement and Zoom function by joystick, Rotation |
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Image Treatment |
Histogram leveling, Averaging, Brightness, Contrast, Inverse,
Embossing, sharpeness(Edge enhancement), Smoothing |
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Inspection Type |
Excessive Solder, Insufficient Solder, Bridge, Short, Misalignment, Void/Crack, and more. | |
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