The MV-3 Series offers Advanced Four Mega Pixel Digital Color Camera Technology in a desktop AOI system. This advanced technology provides the ultimate in inspection performance and speed. The optional Side Viewer® Camera System provides enhanced inspection capability through the addition of four Two Mega Pixel Side View Digital Color Cameras. MIRTEC's MV-3 Series is the world's first generation of five camera Desktop AOI systems


  Technologically advanced Color Inspection using 100% white LED’s (Patent pending)
 
- Provides superior detection of minute lifted leads and lifted components using advanced surface gradient analysis.


  Optional-3D-Beam Laser System
 
- Unsurpassed Inspection for Lifted Leads on SOIC and QFP gull wing devices.
- Four point height measurement for true coplanarity testing of BGA and CSP devices
- Capable of detecting 1㎛ of lead lift


  Optional-Side Viewer® Camera System
 
- Provides enhanced inspection capability with the addition of four two Mega pixel Side View Digital Color Cameras.
- Simplifies operator judgment of defects by simultaneous capturing images from all four sides of the region of interest.
- Provides solder joint inspection of J-Leaded and PLCC devices.


  Independent Quad Angle Lighting System
 
- Four (4) independently programmable zones
- Enhanced detection for Flipped TR, PCB surface / Pad scratch
- Easy detection for same color chips as PCB surface


  Productivity/High Quality maximization
 
Auto Teaching Tool (ATT) Software
- Automatic teaching of component locations using CAD centroid Data
- Supports all mounter data

Library System
- Component library Shortens the teaching and debugging time
  단축
- Library table is automatically compatible with ATT


  Productivity/High Quality maximization
 
Built-in SPC (Statistical Process Control) System
- Promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies

Built-in Repair System
- Provides defect data for simple repair of defective assemblies after inspection
- Defect data for all PCB assemblies is stored in a single data base server


  System Specifications
 
 
Type
  
MV-3L
  
MV-3U
 
Inspection PCB Area 		 
50 x 50 ~ 450 x 400 mm
(2.0 x 2.0 ~17.7 x 15.7 inch) 		 
50 x 50 ~ 660 x 510 mm
(2.0 x 2.0 ~ 26.0 x 20.1 inch)
 
Inspection PCB Thickness 		 
0.5 ~ 3 mm (0.02 ~ 0.12 inch)
 
Field of View
/ Image
Resolution 		 
1.3 Mega 		 
Option 1 		 
15.0 x 11.3 mm (0.59 x 0.44 inch) / 11.7 μm/pixel
 
Option 2 		 
20.4 x 15.3 mm (0.80 x 0.60 inch) / 15.9 μm/pixel
 
2.0 Mega 		 
Option 1 		 
15.7 x 11.8 mm (0.62 x 0.46 inch) / 9.8 μm/pixel
 
Option 2 		 
29.2 x 21.8 mm (1.15 x 0.86 inch) / 18.2 μm/pixel
 
4.0 Mega 		 
Option 1 		 
20.1 x 20.1 mm (0.79 x 0.79 inch) / 9.8 μm/pixel
 
Option 2 		 
37.2 x 37.2 mm (1.46 x 1.46 inch) / 18.2 μm/pixel
 
Inspection
speed 		 
1.3 Mega 		 
Option 1 		 
848 mm2/sec (0.20 sec/frame)
 
Option 2 		 
1,561 mm2/sec (0.20 sec/frame)
 
2.0 Mega 		 
Option 1 		 
842 mm2/sec (0.22 sec/frame)
 
Option 2 		 
2,884 mm2/sec (0.22 sec/frame)
 
4.0 Mega 		 
Option 1 		 
1,443 mm2/sec (0.28 sec/frame)
 
Option 2 		 
4,942 mm2/sec (0.28 sec/frame)
 
Smallest Inspection Component 		 
Option 1 		 
0402 Chip / 0.3 Pitch IC (mm)
01005 Chip / 12 Pitch (mil)
 
Option 2 		 
0603 Chip / 0.4 pitch IC (mm)
0201 Chip / 16 Pitch (mil)
 
Inspection Item 		 
Lifted Lead, Lifted Components, Bridge, Wrong Component, Excessvie Solder, Insufficient Solder, Open Solder, Missing Component, Misalignment, Skew Component, Polarity, Tombstone, Flipped Components, Incorrect Component (OCR Recognition), Pad Scratch, Solder Balls, Lifted Components under QFP/BGA Package (laser Option)
 
Options 		 
3D-Beam, Side Viewer®, NG Marker(Mechanic), Barcode, OLTT, INTELLISYS® (Remote SPC, Remote Repair, Remote Management), 1D or 2D Guntype Barcode Reader
 
Camera Resolution
(High Digital Color Camera) 		 
1.3 Mega (1,280 x 960 Pixels)
 
2.0 Mega (1,600 x 1,200 Pixels)
 
4.0 Mega (2,048 x 2,048 Pixels)
 
Side Viewer® : 2.0 Mega (1,600 x 1,200 Pixels) / 4 set
 
Lighting System 		 
3 Layer LED (Horizontal, Vertical, Coaxial), Quad Angle Lighting System, User defined settings
 
3D-Beam Laser System 		 
Z-Height Repeating Measurement Accuracy: ±20 μm (Resolution: 15 μm/point)
 
PC 		 
Intel® CoreTM 2 Duo, 17" LCD Monitor, Windows XP Professional
 
Machine
Dimensions 		 
1.3 / 2.0 Mega 		 
975(W) x 1,130(D) x 490(H) mm
(38.4 x 44.5 x 19.3 inch) 		 
1185(W) x 1,455(D) x 610(H) mm
(46.7 x 57.3 x 24.0 inch)
 
4.0 Mega 		 
975(W) x 1,200(D) x 610(H) mm
(38.4 x 47.2 x 24.0 inch)
 
Weight 		 
110Kg (243 lbs.) 		 
160Kg (353 lbs.)
 
Power Requirements 		 
Single Phase AC 85~264V, 50/60 Hz
 
Environment 		 
Temperature : 10~40°C, Humidity : 30~80% RH